論文

2022年2月

Thermal and Structural Performance of a Small Satellite with Networked Oscillating Heat Pipes

JOURNAL OF SPACECRAFT AND ROCKETS
  • Naoko Iwata
  • ,
  • Masanori Saitoh
  • ,
  • Keiichi Yanagase
  • ,
  • Yasuhiro Iso
  • ,
  • Yukio Inoue
  • ,
  • Hiroyuki Ogawa
  • ,
  • Yoshiro Miyazaki

記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.2514/1.A35242
出版者・発行元
AMER INST AERONAUTICS ASTRONAUTICS

Typically, spacecraft development is costly and time-consuming because of the many iterations usually needed to reach optimal design solutions. This paper presents an innovative approach that eliminates the need to iterate the thermal design process using a network of variable conductance oscillating heat pipes (VC-OHPs) on every structural panel. The temperatures of the panels where components are mounted would thus be maintained at constant levels by VC-OHPs, even if the instruments' locations or heat dissipation changes. A structural thermal model was built to verify the proposed thermal and structural design in a simulated deep space environment and in a launch environment. It consisted of two VC-OHPs and six aluminum honeycomb panels. A thermal vacuum test was conducted to demonstrate the temperature control by the VC-OHPs. The test results showed that temperature control by VC-OHPs could maintain the panels operating as evaporators at stable temperatures and follow the reservoir temperature. A vibration test was conducted under the launch environment of a Japanese H2A rocket. The results confirmed that the structural thermal model met requirements for resistance to mechanical launch environment. The VC-OHPs functioned after the vibration test. The structural thermal model showed that the proposed thermal control architecture is feasible in an actual spacecraft in terms of thermal and structure design.

リンク情報
DOI
https://doi.org/10.2514/1.A35242
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000760181200001&DestApp=WOS_CPL
ID情報
  • DOI : 10.2514/1.A35242
  • ISSN : 0022-4650
  • eISSN : 1533-6794
  • Web of Science ID : WOS:000760181200001

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