2002年8月
Solidification of nitrogen refrigerant and its effect on thermal stability of HTSC tape
PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS
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- 巻
- 372
- 号
- 開始ページ
- 1434
- 終了ページ
- 1437
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1016/S0921-4534(02)01047-X
- 出版者・発行元
- ELSEVIER SCIENCE BV
We investigated the effect of solidified nitrogen refrigerant upon the thermal stability of HTSC tape. Solid nitrogen was produced by two methods, one by conduction cooling at a very slow cooling rate and another by evacuating the vapor. It was shown experimentally that the thermal stability of HTSC tape is improved drastically when it is impregnated with solid nitrogen produced by the conduction cooling. Furthermore, so-called dry-out phenomenon was dominated by the cumulative energy of the thermal disturbance by the heater. (C) 2002 Elsevier Science B.V. All rights reserved.
- リンク情報
- ID情報
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- DOI : 10.1016/S0921-4534(02)01047-X
- ISSN : 0921-4534
- Web of Science ID : WOS:000178019100035