論文

2002年8月

Solidification of nitrogen refrigerant and its effect on thermal stability of HTSC tape

PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS
  • T Nakamura
  • ,
  • Muta, I
  • ,
  • K Okude
  • ,
  • A Fujio
  • ,
  • T Hoshino

372
開始ページ
1434
終了ページ
1437
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1016/S0921-4534(02)01047-X
出版者・発行元
ELSEVIER SCIENCE BV

We investigated the effect of solidified nitrogen refrigerant upon the thermal stability of HTSC tape. Solid nitrogen was produced by two methods, one by conduction cooling at a very slow cooling rate and another by evacuating the vapor. It was shown experimentally that the thermal stability of HTSC tape is improved drastically when it is impregnated with solid nitrogen produced by the conduction cooling. Furthermore, so-called dry-out phenomenon was dominated by the cumulative energy of the thermal disturbance by the heater. (C) 2002 Elsevier Science B.V. All rights reserved.


リンク情報
DOI
https://doi.org/10.1016/S0921-4534(02)01047-X
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000178019100035&DestApp=WOS_CPL
ID情報
  • DOI : 10.1016/S0921-4534(02)01047-X
  • ISSN : 0921-4534
  • Web of Science ID : WOS:000178019100035

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