2003年
Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu
J. Microelectron Reliab.
- 巻
- 43-2, 259-267
- 号
- DOI
- 10.1016/S0026-2714(02)00239-1
- ID情報
-
- DOI : 10.1016/S0026-2714(02)00239-1