MISC

2003年3月

Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys

JOURNAL OF ALLOYS AND COMPOUNDS
  • YS Kim
  • ,
  • KS Kim
  • ,
  • CW Hwang
  • ,
  • K Suganuma

352
1-2
開始ページ
237
終了ページ
245
記述言語
英語
掲載種別
DOI
10.1016/S0925-8388(02)01168-4
出版者・発行元
ELSEVIER SCIENCE SA

The effects of the addition of Bi to Sn-Zn near eutectic alloy and cooling rate on the thermal and mechanical properties were investigated. With the addition of up to 8 mass% Bi to Sn-8 mass% Zn, the melting temperature decreases from 198.4 to 186.1 degreesC, but the pasty range increases from 2.36 to 6.72 degreesC. Sn-9 mass% Zn and Sn-8 mass% Zn-(1,2,3,6,8) mass% Bi alloys have far lower undercooling than the other Sn-based lead-free alloys, and the temperature decreases with Bi content. It was also confirmed that the difference of cooling rates significantly affects the microstructure and mechanical properties. In the case of fast cooling, alloys have fine Sn, Zn, and Bi phases with smooth surfaces. But in the case of slow cooling, Sn-Zn alloys exhibit coarse dendrite structure and large needle or rod-like Zn-rich precipitates with rough surface and voids, and extensive segregation of massive Bi toward a surface. (C) 2002 Elsevier Science B.V. All rights reserved.

リンク情報
DOI
https://doi.org/10.1016/S0925-8388(02)01168-4
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000181495900039&DestApp=WOS_CPL
ID情報
  • DOI : 10.1016/S0925-8388(02)01168-4
  • ISSN : 0925-8388
  • Web of Science ID : WOS:000181495900039

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