Temperature-tracking is becoming of paramount importance in modern electronic design automation tools. In this paper, we present a deterministic thermal placement algorithm for standard cell based layout which can lead to a smooth temperature distribution over the die. It is mainly based on Fiduccia-Mattheyses partition scheme and a former substrate thermal model that can convert the known temperature constraints into the corresponding power distribution constraints. Moreover, a kind of force-directed heuristic based on cells' power consumption is introduced in the above process. Experimental results demonstrate a comparatively uniform temperature distribution and show a reduction of the maximal temperature on the die.