榎本 俊之

Improving Anti-Adhesive Properties of Cutting Too for Aluminum alloy by Nano/Micro Textures 

Proceedings of 6th International Conference on MicroManufacturing，（2011）189-193 189-193 2011年3月  査読有り

Micro-Milling of Nickel-Based Alloy 

Proceedings of 4th CIRP International Conference on High Performance Cutting No.2,(2010)pp.99-102 2010年10月  査読有り

Improving Anti-Adhesive Properties of Cutting Tool Surfaces by Nano/Micro Textures 

Annals of the CIRP，Vol.59，（2010）pp.597-600 59(1) 597-600 2010年8月  査読有り

Achieving High Flatness of Workpiece Edge Shape by Considering Polishing Pressure 

Key Engineering Materials，No.447-448（2010）pp.71-75 447-448 71-75 2010年7月  査読有り

Achievement of Super-Smooth Surface of Cu by Abrasive-Free CMP Utilizing Vacuum Ultra-Violet Light 

Proceedings of 10th International Conference of the European Society for Precision Engineering and Nanotechnology，（2010）pp.212-215 pp.212-215 2010年5月  査読有り

Improving anti-adhesive properties of cutting tool surfaces by nano-/micro-textures 

CIRP ANNALS-MANUFACTURING TECHNOLOGY 59(1) 597-600 2010年  

Achievement of High Flatness of Large Diameter Silicon Wafer in Double-Sided Polishing - Optimization of Polishing Conditions Considering Relative Motion Direction - 

Proceedings of the ASME 2009 International Manufacturing Science and Engineering Conference (2010)pp.232-236 671-676 2009年10月  査読有り

The Edge Roll Off Generation Mechanism in Polishing by Considering The Viscoelasticity of Polishing Pads 

Proceedings of the ASME 2009 International Manufacturing Science and Engineering Conference (2009)No.84063 677-682 2009年10月  査読有り

Development of a Cutting Tool with a Textured Surface for Dry Cutting of Aluminum Alloys 

International Journal of Automation Technology, Vo.3，No.2（2009）pp.199-203 Vo.3,No.2,pp.199-203(2) 199-203 2009年3月  査読有り

ACHIEVEMENT OF HIGH FLATNESS OF LARGE DIAMETER SILICON WAFER IN DOUBLE-SIDED POLISHING OPTIMIZATION OF POLISHING CONDITIONS CONSIDERING RELATIVE MOTION DIRECTION 

PROCEEDINGS OF THE ASME INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE, VOL 1 (2009)No.84055 671-676 2009年  

Achievement of High Flatness of Large Diameter Silicon Wafer in Double-Sided Polishing – Optimization of Polishing Conditions Based on Kinematical Analysis - 

Proceedings of 23rd Annual Meeting of the American Society for Precision Engineering，pp.396-399 pp.396-399(746) 2601-2606 2008年10月  

A Cutting Tool with Nano/Micro-Textured Surface for achievement of High Anti-Adhesive Effect 

Proceedings of 23rd Annual Meeting of the American Society for Precision Engineering，pp.534-537 pp.534-537 2008年10月  

Development of a Lapping Film Utilizing Agglomerative Fine Abrasives for Finishing of Optical Glass 

Proceedings of 17th Annual Meeting of the American Society for Precision Engineering, pp.657-660 657-660(684) 234-239 2002年10月  査読有り

Development of an Ultra-Thin Dicing Blade Applying Ultra-Violet Curable Resin 

Proceedings of 6th International Conference on Mechatronics Technology, pp.266-271 266-271 2002年9月  査読有り

Development of a Lapping Film Utilizing Agglomerative Superfine Silica Abrasives for Edge Finishing of a Silicon Wafer 

Proceedings of 10th International Conference on Precision Engineering, pp.391-395 391-395 2001年7月  査読有り

マイクロカプセルを利用したラッピング砥石 

砥粒加工学会誌 44(12) 542-545 2000年12月  招待有り筆頭著者

Development of a Resinoid Diamond Wire Containing Metal Powder for Slicing a Silicon Ingot 

Annals of the CIRP, Vol.48, No.1, pp.273-276 65(631) 1235-1240 1999年8月  査読有り