2006年1月
Recrystallization process of phosphorus ion implanted 4H-SiC(112-0)
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS
- ,
- ,
- 巻
- 242
- 号
- 1-2
- 開始ページ
- 627
- 終了ページ
- 629
- 記述言語
- 英語
- 掲載種別
- DOI
- 10.1016/j.nimb.2005.08.093
- 出版者・発行元
- ELSEVIER SCIENCE BV
The recrystallization process of the phosphorus ion implantation-induced amorphous layer in 4H-SiC(1 1 2-0) is investigated in the annealing temperature range from 660 to 720 degrees C by means of Rutherford backscattering spectrometry. The phosphorus ions are multiply implanted to p-type 4H-SiC(1 1 2-0) at the energy range from 40 to 230 keV at a total fluence of 1 x 10(15) cm(-2) to form the implantation layer with a phosphorus concentration of 4.0 x 10(20) cm(-3) and a thickness of 200 nm. The amorphous-substrate interface shifts to the surface in equal thickness intervals for equal annealing time intervals, indicating a uniform recrystallization velocity. The recrystallization rate for the phosphorus implanted 4H-SiC(1 1 2-0) is 4 times faster than that in argon implanted samples and increased with an activation energy of 3.4 eV, which is identical to that of the recrystallization of amorphized 6H-SiC(1 1 2-0) and (1 1 -0 0). (c) 2005 Elsevier B.V. All rights reserved.
- リンク情報
- ID情報
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- DOI : 10.1016/j.nimb.2005.08.093
- ISSN : 0168-583X
- eISSN : 1872-9584
- Web of Science ID : WOS:000236225200170