論文

査読有り
2018年6月1日

Electrical and Thermal Conductivity and Conduction Mechanism of Ge2Sb2Te5 Alloy

Journal of Electronic Materials
  • Rui Lan
  • ,
  • Rie Endo
  • ,
  • Masashi Kuwahara
  • ,
  • Yoshinao Kobayashi
  • ,
  • Masahiro Susa

47
6
開始ページ
3184
終了ページ
3188
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1007/s11664-017-5932-8
出版者・発行元
Springer New York LLC

Ge2Sb2Te5 alloy has drawn much attention due to its application in phase-change random-access memory and potential as a thermoelectric material. Electrical and thermal conductivity are important material properties in both applications. The aim of this work is to investigate the temperature dependence of the electrical and thermal conductivity of Ge2Sb2Te5 alloy and discuss the thermal conduction mechanism. The electrical resistivity and thermal conductivity of Ge2Sb2Te5 alloy were measured from room temperature to 823 K by four-terminal and hot-strip method, respectively. With increasing temperature, the electrical resistivity increased while the thermal conductivity first decreased up to about 600 K then increased. The electronic component of the thermal conductivity was calculated from the Wiedemann–Franz law using the resistivity results. At room temperature, Ge2Sb2Te5 alloy has large electronic thermal conductivity and low lattice thermal conductivity. Bipolar diffusion contributes more to the thermal conductivity with increasing temperature. The special crystallographic structure of Ge2Sb2Te5 alloy accounts for the thermal conduction mechanism.

リンク情報
DOI
https://doi.org/10.1007/s11664-017-5932-8
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000431920400018&DestApp=WOS_CPL
URL
http://orcid.org/0000-0002-0336-0891
ID情報
  • DOI : 10.1007/s11664-017-5932-8
  • ISSN : 0361-5235
  • ORCIDのPut Code : 45753111
  • SCOPUS ID : 85034636274
  • Web of Science ID : WOS:000431920400018

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