2017年11月
Enhanced Adhesion Strength between Silicon Substrate and Metal Film by Surface Fluorination
CHEMISTRY LETTERS
- ,
- ,
- 巻
- 46
- 号
- 11
- 開始ページ
- 1643
- 終了ページ
- 1645
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1246/cl.170739
- 出版者・発行元
- CHEMICAL SOC JAPAN
The surface of silicon wafer was treated with F-2 gas at 25 degrees C for 10-120 min. The surface roughness (R-a) of silicon fluorinated for 120 min was 7 times larger than that (3.2 nm) of untreated silicon. Also, the water contact angle of fluorinated silicon decreased to 7 degrees. The adhesion strength of Ni metal deposited on the silicon substrate could be enhanced by surface fluorination due to increased roughness and hydrophilic surface of the silicon substrate.
- リンク情報
- ID情報
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- DOI : 10.1246/cl.170739
- ISSN : 0366-7022
- eISSN : 1348-0715
- Web of Science ID : WOS:000412104400015