MA Xin

Strengthening Sn60-Pb40 Solder Alloy by Adding Trace Amount of La 

Materials Letters 52(4(5): 319-322) 2002年  

Effect of La on the Cu-Sn IMC growth and solder joint reliability 

Journal of Alloys and Compounds 334(1(2): 224-227) 2002年  

Interaction relation in 60Sn-Pb-0.05La ternary solder alloy 

Materials Letters 56(4): 441-445 2002年  

The stress field characteristics in the surface mount solder joints under temperature cycling: temperature effect and its evaluation 

Welding Journal 81(6): 85s-89s 2002年  

Microindentation study on the rate sensitivity of non-homogeneous solder alloy 

Journal of Materials Science Letters 21(18): 1397-1399 2002年  

Relative Damage Stress and Its Application in the Case of Temperature Cycling Load 

Progress in Natural Science 11(2):156-160 2001年  

Finite Element Simulation of Mechanical Response of Solder Joints in Surface Mount Package Under Different Temperature Cycling Profile 

Trans. Nonferrous Met. Soc. China 11(4): 471-474 2001年  

Penetrating behavior of eutectic liquid during Al/Cu contact reactive brazing 

Trans. Nonferrous Met. Soc. China 11(5): 664-666 2001年  

Effect of La on the Sn-rich halo formation in Sn60-Pb40 alloy 

Journal of Alloys and Compounds 327(1(2): 263-266) 2001年  

Effect of Rare Earth Elements on the Solidification Microstructure and High Temperature Mechanical Property of Sn60-Pb40 Solder Alloy 

Journal of Rare Earths 18(4): 289-292 2000年  

Prediction for Uniaxial Mechanical Response of SnPb Eutectic Alloy 

Journal of the Japanese High Temperature Society 25(3):103-108 1999年