2019年8月
Effects of Compressive Force and Dielectric Materials on Contact Area for High-pressure Region and Interfacial AC Breakdown between Two Solid Dielectrics
21st International Symposium on High Voltage Engineering (ISH2019), Budapest, Hungary, 12 pages
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- 記述言語
- 英語
- 掲載種別
- 研究論文(国際会議プロシーディングス)
- 出版者・発行元
- 21st International Symposium on High Voltage Engineering
A weak point of the connection between the power cable and the switchgear is the low breakdown strength along the interface between the two solid dielectrics. This is because micro-cavities are formed by the roughness of the dielectric sur-face between the two solid dielectrics. In a previous work, we investigated the ef-fects of compressive force and dielectric materials on interfacial AC breakdown voltage (interfacial AC-BDV).
- ID情報
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- ORCIDのPut Code : 1487
- ORCIDのPut Code : 4879