論文

査読有り 責任著者
2019年8月

Effects of Compressive Force and Dielectric Materials on Contact Area for High-pressure Region and Interfacial AC Breakdown between Two Solid Dielectrics

21st International Symposium on High Voltage Engineering (ISH2019), Budapest, Hungary, 12 pages
  • KATO MASAKI
  • ,
  • NISHIMURA YUYA
  • ,
  • OSAWA NAOKI
  • ,
  • YOSHIOKA YOSHIO
  • ,
  • YANASE HIRONORI
  • ,
  • OKAMOTO KENJI

記述言語
英語
掲載種別
研究論文(国際会議プロシーディングス)
出版者・発行元
21st International Symposium on High Voltage Engineering

A weak point of the connection between the power cable and the switchgear is the low breakdown strength along the interface between the two solid dielectrics. This is because micro-cavities are formed by the roughness of the dielectric sur-face between the two solid dielectrics. In a previous work, we investigated the ef-fects of compressive force and dielectric materials on interfacial AC breakdown voltage (interfacial AC-BDV).

ID情報
  • ORCIDのPut Code : 1487
  • ORCIDのPut Code : 4879

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