論文

査読有り
2016年

Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product

Jurnal Teknologi
  • Annuar Ismail
  • ,
  • Rozzeta Dolah
  • ,
  • Zenichi Miyagi

78
1
開始ページ
175
終了ページ
179
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.11113/jt.v78.4278
出版者・発行元
Penerbit UTM Press

Market demand on system-on-chip (SoC) using ball-attach technologies, it is time for ball-attach module to have an improvement on their capabilities within limited resources (man and machine). This paper identifies caused of factor which contributes more time to production time. Justification on improving ball-attach module cycle time during high volume activities is explained.

リンク情報
DOI
https://doi.org/10.11113/jt.v78.4278

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