2016年
Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product
Jurnal Teknologi
- ,
- ,
- 巻
- 78
- 号
- 1
- 開始ページ
- 175
- 終了ページ
- 179
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.11113/jt.v78.4278
- 出版者・発行元
- Penerbit UTM Press
Market demand on system-on-chip (SoC) using ball-attach technologies, it is time for ball-attach module to have an improvement on their capabilities within limited resources (man and machine). This paper identifies caused of factor which contributes more time to production time. Justification on improving ball-attach module cycle time during high volume activities is explained.
- リンク情報