MISC

2006年4月

Deoxidization of Cu oxide under extremely low oxygen pressure ambient

JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS
  • K Endo
  • ,
  • N Shirakawa
  • ,
  • Y Yoshida
  • ,
  • S Ikeda
  • ,
  • T Mino
  • ,
  • E Gofuku
  • ,
  • E Suzuki

45
12-16
開始ページ
L393
終了ページ
L395
記述言語
英語
掲載種別
DOI
10.1143/JJAP.45.L393
出版者・発行元
INST PURE APPLIED PHYSICS

Cu oxide has been deoxidized in an extremely low oxygen partial pressure atmosphere. The oxygen was evacuated to 10(-28) atm using a,newly developed oxygen reduction system (ORS). It was experimentally demonstrated that the surface oxide of Cu film was completely removed by exposure to such an environment at 200 degrees C. The proposed deoxidization reaction can be used as a new Cu surface cleaning technique.

Web of Science ® 被引用回数 : 9

リンク情報
DOI
https://doi.org/10.1143/JJAP.45.L393
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000237571200015&DestApp=WOS_CPL
ID情報
  • DOI : 10.1143/JJAP.45.L393
  • ISSN : 0021-4922
  • Web of Science ID : WOS:000237571200015

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