2006年4月
Deoxidization of Cu oxide under extremely low oxygen pressure ambient
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS
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- 巻
- 45
- 号
- 12-16
- 開始ページ
- L393
- 終了ページ
- L395
- 記述言語
- 英語
- 掲載種別
- DOI
- 10.1143/JJAP.45.L393
- 出版者・発行元
- INST PURE APPLIED PHYSICS
Cu oxide has been deoxidized in an extremely low oxygen partial pressure atmosphere. The oxygen was evacuated to 10(-28) atm using a,newly developed oxygen reduction system (ORS). It was experimentally demonstrated that the surface oxide of Cu film was completely removed by exposure to such an environment at 200 degrees C. The proposed deoxidization reaction can be used as a new Cu surface cleaning technique.
- リンク情報
- ID情報
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- DOI : 10.1143/JJAP.45.L393
- ISSN : 0021-4922
- Web of Science ID : WOS:000237571200015