論文

2020年4月

Advanced layer transfer technology of post-Si materials for heterogeneous integration

4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings
  • Tatsuro Maeda
  • ,
  • Toshifumi Irisawa
  • ,
  • Hiroyuki Ishii
  • ,
  • Wen Hsin Chang

記述言語
掲載種別
研究論文(国際会議プロシーディングス)
DOI
10.1109/EDTM47692.2020.9117804

© 2020 IEEE. Post-Si materials, such as Ge or III-V compound semiconductors, have been considered as alternative channel materials to Si as well as optical components for adding new functions into current Si-LSI. It is necessary to form high quality Ge or III-V compound semiconductor layers onto Si wafers for realization of Si or post-Si hybrid devices. Combing high quality hetero-epitaxial growth, low-temperature bonding and advanced lift-off techniques, we have achieved Ge or III-V layer transfer on Si while possessing high crystallinity, and also validated superior device performance. Advanced layer transfer technology of Ge or III-V compound semiconductors provides a flexible opportunity to elaborate monolithic heterogeneous integration in a cost effective manner.

リンク情報
DOI
https://doi.org/10.1109/EDTM47692.2020.9117804
Scopus
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85091966106&origin=inward
Scopus Citedby
https://www.scopus.com/inward/citedby.uri?partnerID=HzOxMe3b&scp=85091966106&origin=inward
ID情報
  • DOI : 10.1109/EDTM47692.2020.9117804
  • SCOPUS ID : 85091966106

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