2020年4月
Advanced layer transfer technology of post-Si materials for heterogeneous integration
4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings
- ,
- ,
- ,
- 記述言語
- 掲載種別
- 研究論文(国際会議プロシーディングス)
- DOI
- 10.1109/EDTM47692.2020.9117804
© 2020 IEEE. Post-Si materials, such as Ge or III-V compound semiconductors, have been considered as alternative channel materials to Si as well as optical components for adding new functions into current Si-LSI. It is necessary to form high quality Ge or III-V compound semiconductor layers onto Si wafers for realization of Si or post-Si hybrid devices. Combing high quality hetero-epitaxial growth, low-temperature bonding and advanced lift-off techniques, we have achieved Ge or III-V layer transfer on Si while possessing high crystallinity, and also validated superior device performance. Advanced layer transfer technology of Ge or III-V compound semiconductors provides a flexible opportunity to elaborate monolithic heterogeneous integration in a cost effective manner.
- リンク情報
- ID情報
-
- DOI : 10.1109/EDTM47692.2020.9117804
- SCOPUS ID : 85091966106