論文

2014年5月27日

Laser-based Conductive Film Forming with Gold Nanoparticles for Electrical Contacts

64th Electronic Components and Technology Conference (ECTC 2014), Lake Buena Vista, Florida, USA, May 27-30, 2014
  • Mitsugu YAMAGUCHI
  • ,
  • Shinji ARAGA
  • ,
  • Mamoru MITA
  • ,
  • Kazuhiko YAMASAKI
  • ,
  • Katsuhiro MAEKAWA

開始ページ
2194
終了ページ
2199
記述言語
英語
掲載種別
研究論文(国際会議プロシーディングス)
出版者・発行元
IEEE

The present study discusses the formation of a conductive film from noble metal nanoparticles as an alternative to conventional electroplating for electrical components, such as connectors, switches, and memory cards. The proposed method consists of inkjet printing with nanoparticle paste followed by laser sintering. The aims are fourfold: to establish sintering technology for gold nanoparticles placed on a nickel-electroplated-phosphor bronze substrate, to characterize the laser-sintered film, to discuss the laser sintering mechanism, and to examine applicability to industry. The major results obtained are as follows: the laser sintering formed a gold film with a diameter of 0.3-0.8 mm and a thickness of 0.3-0.5 mu m on the nickel-electroplated phosphor-bronze substrate; a laser with a wavelength of 915 nm enabled instantaneous sintering within one second in an atmosphere; the laser-sintered gold nanoparticle film had such a high adhesion to the substrate that no separation occurred after 90 degrees-0.5R bend-peel tests; the high adhesion was attributed to interdiffusion of gold and nickel in the course of sintering; optical properties of the gold nanoparticle paste depend on preheat conditions. A relatively high-preheat temperature around 523 K produced a paste surface with a suitable absorbance of the infrared laser; and a primary sintering of the preheated gold nanoparticles with a small amount of solvents, followed by an auxiliary sintering from the substrate side made possible an efficient sintering of the nanoparticles as well as high adhesion to the substrate with a high thermal conductivity.

リンク情報
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000361546100346&DestApp=WOS_CPL
ID情報
  • ISSN : 0569-5503
  • Web of Science ID : WOS:000361546100346

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