2019年
Investigation of TSV Liner Interface with Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC
IEEE Journal of the Electron Devices Society
- ,
- ,
- 巻
- 7
- 号
- 開始ページ
- 1225
- 終了ページ
- 1231
- 記述言語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1109/JEDS.2019.2936180
© 2013 IEEE. Mixed-signal 3D-ICs have a stacked structure of digital and analog circuit chips. In this study, the effect of noise propagation from a digital circuit on an analog circuit was evaluated using an actual mixed-signal 3D-IC. The noise propagation via through-silicon vias (TSVs) was measured, with a ring-oscillator as a noise source. For a comprehensive investigation, TSV-liner interface states were evaluated along the depth direction using unique multiwell-structured TSVs and a charge-pumping method. It was considered that the interface traps and nonconformal thickness of the TSV liner increased the noise propagation among stacked chips.
- リンク情報
- ID情報
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- DOI : 10.1109/JEDS.2019.2936180
- eISSN : 2168-6734
- SCOPUS ID : 85076552105