論文

査読有り
2010年

Profile measurement based on spectral interferometer with multi-wavelength back-propagation methods

OPTICAL METROLOGY AND INSPECTION FOR INDUSTRIAL APPLICATIONS
  • Kohei Otsuki
  • ,
  • Samuel Choi
  • ,
  • Osami Sasaki
  • ,
  • Takamasa Suzuki

7855
記述言語
英語
掲載種別
研究論文(国際会議プロシーディングス)
DOI
10.1117/12.870987
出版者・発行元
SPIE-INT SOC OPTICAL ENGINEERING

The multi-wavelength back-propagation (MWB) method enables to determine precisely the optical path different (OPD) longer than the optical wavelength from detecting the amplitude and phase of the interference signal for the multiple wavelengths. In this study, we demonstrate a 1-dimensional thickness profile measurement by the MWB and sinusoidal phase modulation (SPM) technique with a spectral interferometer. The OPD for the front and rear reflecting surfaces of a glass film with the thickness of 100 mu m are measured. The thickness profile is successfully measured with repeatability of 2 nm estimated from a standard error between 9 repeatedly-measured profiles.

リンク情報
DOI
https://doi.org/10.1117/12.870987
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000287663000022&DestApp=WOS_CPL
ID情報
  • DOI : 10.1117/12.870987
  • ISSN : 0277-786X
  • Web of Science ID : WOS:000287663000022

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