2010年
Profile measurement based on spectral interferometer with multi-wavelength back-propagation methods
OPTICAL METROLOGY AND INSPECTION FOR INDUSTRIAL APPLICATIONS
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- 巻
- 7855
- 号
- 記述言語
- 英語
- 掲載種別
- 研究論文(国際会議プロシーディングス)
- DOI
- 10.1117/12.870987
- 出版者・発行元
- SPIE-INT SOC OPTICAL ENGINEERING
The multi-wavelength back-propagation (MWB) method enables to determine precisely the optical path different (OPD) longer than the optical wavelength from detecting the amplitude and phase of the interference signal for the multiple wavelengths. In this study, we demonstrate a 1-dimensional thickness profile measurement by the MWB and sinusoidal phase modulation (SPM) technique with a spectral interferometer. The OPD for the front and rear reflecting surfaces of a glass film with the thickness of 100 mu m are measured. The thickness profile is successfully measured with repeatability of 2 nm estimated from a standard error between 9 repeatedly-measured profiles.
- リンク情報
- ID情報
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- DOI : 10.1117/12.870987
- ISSN : 0277-786X
- Web of Science ID : WOS:000287663000022