SHIMATSU Takehito

J-GLOBAL         Last updated: Oct 4, 2019 at 14:45
 
Avatar
Name
SHIMATSU Takehito
E-mail
shimatsuriec.tohoku.ac.jp
URL
http://db.tohoku.ac.jp/whois/e_detail/fc46c316ef8550d939fb15f6cb55933c.html
Affiliation
Tohoku University
Section
Frontier Research Institute for Interdisciplinary Sciences Advanced Interdisciplinary Research Division Information and System
Job title
Professor
Degree
Ph.D.(Tohoku University)

Research Areas

 
 

Education

 
 
 - 
Mar 1988
電子工学, Graduate School, Division of Engineering, Tohoku University
 
 
 - 
Mar 1986
電子工学, Faculty of Engineering, Tohoku University
 

Awards & Honors

 
May 2019
Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding, Best Poster Presentation Award, 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 191st Committee on Innovative Interface Bonding Technology Japan Society for the Promotion of Science (JSPS)
Winner: T. Saito, H. Makita, T. Moriwaki, Y. Suzuki, N. Kato, S. Wakayanagi, A. Miura, M. Uomoto and T. Shimatsu
 
Oct 2018
Atomic Diffusion Bonding for Optical Devices with High Optical Density, AiMES 2018 ECS and SMEQ Joint International Meeting Best Paper Award, Electrochemical Society (ECS)
Winner: G. Yonezawa, Y. Takahashi, Y. Sato, S. Abe, M. Uomoto and T. Shimatsu
 
Jan 2018
Frequency dependence of microwave-assisted switching in CoCrPt granular perpendicular media, Magnetics and Optics Research International Symposium(MORIS 2018)  Best Poster Award, University of New York, Japan Society for thePpromotion of Science
Winner: Kyohei Shimada, Takehito Shimatsu, Nobuaki Kikuchi, Satoshi Okamoto, Osamu Kitakami
 
Oct 2016
High Output Power Deep Ultraviolet Light-Emitting Diodes with Hemispherical Lenses Fabricated Using Room-Temperature Bonding, Best Presentation Award Among Invited Papers, 230th Meeting of The Electrochemical Society (ECS), PRiME 2016, Semiconductor Wafer Bonding 14: Science, Technology and Applications, Electrochemical Society (ECS)
Winner: M. Ichikawa, S. Endo, H. Sagawa, A. Fujioka, T. Kosugi, T. Mukai, M. Uomoto, and T. Shimatsu
 
Jul 2015
Auキャップ付金属薄膜を用いたウエハの大気中室温接合Ⅱ(Cu, Al 薄膜), 第29回エレクトロニクス実装学会春季講演大会 優秀賞, 一般社団法人 エレクトロニクス実装学会
Winner: 魚本 幸,今 一恵,島津 武仁
 

Published Papers

 
Fengwen Mu, Tadatomo Suga, Miyuki Uomoto, Takehito Shimatsu, Kenichi Iguchi, Haruo Nakazawa
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, IEEE   4   Jun 2019   [Refereed]
Noboru Ebizuka, Takayuki Okamoto, Minoru Sasaki, Ichi Tanaka, Miyuki Uomoto, Takehito Shimatsu
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, IEEE   77   Jun 2019   [Refereed]
S. Matsuda, M. Uomoto, A. Miura, and T. Shimatsu
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, IEEE   67   Jun 2019   [Refereed]
A. Muraoka, M. Uomoto, M. Abe, and T. Shimatsu
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, IEEE   66   Jun 2019   [Refereed]
M. Uomoto and T. Shimatsu
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, IEEE   65   Jun 2019   [Refereed]
T. Saito, H. Makita, T. Moriwaki, Y. Suzuki, N. Kato, S. Wakayanagi, A. Miura, M. Uomoto and T. Shimatsu
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, IEEE   64   Jun 2019   [Refereed]
G. Yonezawa, Y. Sato, S. Abe, M. Uomoto and T. Shimatsu
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, IEEE   63   Jun 2019   [Refereed]
Near-Zero TCF of HAL SAW Resonator with LiTaO3-on-Quartz Structure
Michio Kadota, Yoshimi Yunoki, Takehito Shimatsu, Miyuki Uomot, Shuji Tanaka
1-4   Jan 2019   [Refereed]
Michio Kadota, Yoshimi Ishii Yunoki, Takehito Shimatsu, Miyuki Uomoto, Shuji Tanaka
Proceedings of 2018 IEEE International Ultrasonics Symposium (IUS)   1-9   Dec 2018   [Refereed]
G. Yonezawa, Y. Takahashi, Y. Sato, S. Abe, M. Uomoto, and T. Shimatsu
ECS Transactions   86(5) 233-245   Sep 2018   [Refereed]
M. Uomoto, A. Muraoka, and T. Shimatsu
ECS Transactions   86(5) 199-204   Sep 2018   [Refereed]
MICROWAVE ASSISTED SWITCHING BEHAVIOR OF COCRPT BASED GRANULAR MEDIA
Nobuaki KIKUCHI, Kyohei SHIMADA, Shun KIKUCHI, Katsunari SATO, Satoshi OKAMOTO, Osamu KITAKAMI, Takehito SHIMATSU
Digest of the 29th Magnetic Recording Conference 2018(TMRC2018)   41-42   Aug 2018
Tuning Magnetic Anisotropy and Curie Temperature of L10-FePt Granular films
T. Shimatsu, T. Ono, T. Moriya, H. Nakata, K. Komiyama,S. Uchida, H. Oyama, H. Kikuchi, H. Kataoka, K. Sato, A. Furuta, T. Yoshizawa, M. Hatayama, K. Tsumura, N. Kikuchi, and O. Kitakami
Digest of the 28th Magnetic Recording Conference 2017(TMRC2017)      Aug 2017   [Invited]
Tsukuba, August(2017) A-1
T. Shimatsu, M. Uomoto, and H. Kon
ECS Transactions   64(5) 317-328   2014   [Refereed][Invited]
226th ECS, Cancun, October 2014
T. Shimatsu and M. Uomoto
Journal of Vacuum Science and Technology B   28(4) 706-714   Jul 2010   [Refereed]
2nd Int. IEEE Workshop on LTB-3D, Published online 28 June 2010
T. Shimatsu, H. Sato, T. Oikawa, Y. Inaba, O. Kitakami, S. Okamoto, H. Aoi, H. Muraoka, and Y. Nakamura
IEEE Transactions on Magnetics   41(9) 566-571   Jan 2005   [Refereed][Invited]
Miyuki Uomoto, Yuki Yamada, Takuya Hoshi, Masahiro Nada and Takehito Shimatsu
Japanese Journal of Applied Physics   57 02BA03(1-3)   Dec 2017   [Refereed]
published online December 7, 2017
N. Ebizuka, T. Okamoto, M. Takeda, T. Hosobata, Y. Yamagata, M. Sasaki, M. Uomoto, T. Shimatsu, S. Sato, N. Hashimoto, I. Tanaka, T. Hattori, S. Ozaki, W. Aoki
Proc. SPIE 10233, Holography: Advances and Modern Trends V   (10233) M1-M8   Jun 2017   [Refereed]
ISBN: 9781510609679
ISBN: 9781510609686 (electronic)
Magnetization switching of a dipolar coupled layered magnetic nanodot under the assistance of microwave
Daiki KANAHARA, Satoshi OKAMOTO, Nobuaki KIKUCHI, Osamu KITAKAMI and Takehito SHIMATSU
IEICE Technical Report   117(80) 53-58   Jun 2017
MR2017-8
M. Uomoto, Y. Yamada, T. Hoshi, M. Nada, and T. Shimatsu
Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017   50   May 2017   [Refereed]
LTB-3D 2017
ISBN: 978-4-904743-03-4

Misc

 
Room Temperature Bonding of Ceramics and Other Materials Using Thin Metal Films
Takehito SHIMATSU and Miyuki UOMOTO
CERAMICS JAPAN   51(2) 91-93   Feb 2016
Industry-University Collaboration for "Mono-Zukuri"
島津 武仁
Journal of The Japan Institute of Electronics Packaging   18(7)    Nov 2015
Room Temperature Bonding of Wafers with Thin Nanocrystalline Metal Films and Its Application to Devices Fabrication
Takehito SHIMATSU and Miyuki UOMOTO
The Japan Society for Precision Engineering   79(8) 710-713   Aug 2013
原子拡散接合法によるウエハ室温接合技術とエタロンフィルタへの応用
島津 武仁,魚本 幸,今 一恵,若林 小太郎,大場 健司,古堅 由紀子
OPTRONICS   32(7) 88-92   Jul 2013
島津 武仁,魚本 幸
Materia Japan   49(11) 521-527   Nov 2010

Books etc

 
異種材料一体化のための最新技術 ~溶接・接着剤・一体形成・加飾~
森 邦夫,金子大作,三浦高行,竹本 正,安田清和,須賀唯知,島津武仁 他25名 (Part:Joint Work, 第7章 各技術要素における一体化の参考例 第7節 金属薄膜を用いた原子拡散接合法によるウエハの室温接合)
サイエンス&テクノロジー株式会社   Jan 2012   ISBN:978-4-86428-036-5
advanced Technologies of Perpendicular Magnetic Recording
中村慶久, 村岡裕明, 沼澤潤二, 島津武仁 他(中村慶久 監修) (Part:Supervisor, 第5章 垂直磁気記録媒体技術 2 Co-Pt-Cr-SiO2系記録層材料(p.148-157))
シーエムシー出版   Jul 2007   

Conference Activities & Talks

 
SiC-SiC temporary bonding compatible with rapid thermal annealing at 1000 ℃
Fengwen Mu, Tadatomo Suga, Miyuki Uomoto, Takehito Shimatsu, Kenichi Iguchi, Haruo Nakazawa
WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2019)   21 May 2019   
Novel Gratings for Astronomical Observations Fabricated by Latest Technologies
N. Ebizuka, T. Okamoto, M. Sasaki, I. Tanaka, M. Uomoto and T. Shimatsu
WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2019)   21 May 2019   
Rearrangement of Crystal Lattice Occurred at Ag/Ag Bonded Interface in Atomic Diffusion Bonding
S. Matsuda, M. Uomoto, A. Miura, and T. Shimatsu
WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2019)   21 May 2019   
Atomic Diffusion Bonding of Wafers using a-Ge Films with Extremely Low Electrical Conductivity
A. Muraoka, M. Uomoto, M. Abe, and T. Shimatsu
WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2019)   21 May 2019   
Atomic Diffusion Bonding of Wafers Using Thin Nb Films
M. Uomoto and T. Shimatsu
WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2019)   21 May 2019   
Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding
T. Saito, H. Makita, T. Moriwaki, Y. Suzuki, N. Kato, S. Wakayanagi, A. Miura, M. Uomoto and T. Shimatsu
WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2019)   21 May 2019   
Oxidation of Bonded Thin Ti Films Using Oxide Underlayers in Atomic Diffusion Bonding Process for Optical Applications
G. Yonezawa, Y. Sato, S. Abe, M. Uomoto and T. Shimatsu
WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration(LTB-3D 2019)   21 May 2019   
Atomic Diffusion Bonding: Room Temperature Bonding of Wafers for Creating the Future of Electronic and Optical Devices [Invited]
Takehito Shimatsu
3D & SYSTEMS SUMMIT   28 Jan 2019   
Suprious-Free, Near-Zero-TCF Hetero Acoustic Layer (HAL)SAW Resonators Using LiTaO3Thin Plate on Quartz
Michio Kadota, Yoshimi Ishii Yunoki, Takehito Shimatsu, Miyuki Uomoto, Shuji Tanaka
2018 IEEE International Ultrasonics Symposium (IUS)   25 Oct 2018   
6J-2
Microwave assisted switching behavior of CoCrPt based granular media [Invited]
N. Kikuchi, K. Shimada, S. Kikuchi, K. Sato, S. Okamoto, O. Kitakami, T. Shimatsu
The 29th Magnetic Recording Conference (TMRC 2018)   18 Aug 2018   

Research Grants & Projects

 
原子拡散接合法による室温接合技術の開発とデバイス形成への応用
Project Year: Apr 2008 - Today
High density perpendicular recording media
Project Year: Apr 1989 - Today
Sputter film deposition process and microstructure of the deposited thin metal films
Project Year: Apr 1990 - Today

Social Contribution

 
文部科学省指定SSH(スーパーサイエンスハイスクール)事業
[Others]  16 Sep 2017
「フロンティアスピリットを持つ「サイエンスリーダー」の育成を目指して」講師
パワーエレクトロニクスと半導体産業の新展開
[Others]  31 Oct 2016
みやぎ高度電子機械産業振興協議会及び一般社団法人エレクトロニクス実装学会共催の半導体分野セミナー
文部科学省指定SSH(スーパーサイエンスハイスクール)事業
[Others]  3 Sep 2016
「理数系教育のパイオニアハイスクールをめざして~山梨の中核拠点校として、世界に羽ばたく科学技術系人材を育てる~」講師
文部科学省指定SSH(スーパーサイエンスハイスクール)事業
[Others]  5 Sep 2015
「理数系教育のパイオニアハイスクールをめざして~山梨の中核拠点校として、世界に羽ばたく科学技術系人材を育てる~」講師