池田 徹

Predicting Technique of Delamination at Adhesively Bonding Joints in an Flip Chip Package during Solder Reflow Process 

Proceedings CD-ROM of ASME InterPACK 2005 IPACK-75153, pp. 1-9 2005年  

Experimental and Numerical Evaluation of Residual Stress in IC Chips 

Proceedings CD-ROM of ASME InterPACK 2005 IPACK2005-73110, pp. 1-6 2005年  

異方性導電樹脂接合型フリップチップの吸湿リフロー試験時のはく離予測解析 

エレクトロニクス実装学会誌 第8巻, 第2号, pp. 215-224. 2005年  

Reliability of Adhesively Conductive Technique 

Journal of Japan Institute of Electronics Packaging (in Japanese) Vol. 8, No. 1, pp. 72-78. 2005年  

Predicting Technique of Delamination at Adhesively Bonding Joints in an Flip Chip Package during Solder Reflow Process 

Proceedings CD-ROM of ASME InterPACK 2005 IPACK-75153, pp. 1-9 2005年  

Experimental and Numerical Evaluation of Residual Stress in IC Chips 

Proceedings CD-ROM of ASME InterPACK 2005 IPACK2005-73110, pp. 1-6 2005年  

Reliability Evaluation of Interconnection Using Anisotropic Conductive Adhesive Films (Effects of ACF Resins, Substrates and Bump-Heights) 

Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004) pp. 488-493 2004年  

Mechanical Reliability of Anisotropic Conductive Adhesive Films under Moisture/Reflow Sensitivity Test 

Proceedings CD-ROM of the Sixth World Congress on Computational Mechanics in conjunction with the Second Asian-Pacific Congress on Computational Mechanics R501, pp. 1-10 2004年  

Damage Analysis of a Crack in a Thin Adhesive Layer between Hard Adherends 

Proceedings of the 11th US-Japan Conference on Composite Materials Adhe 3-1, pp. 1-4 2004年  

Nodal Relocation Method Applied to Adaptive Analysis of Meshfree Mthod 

Proceedings CD-ROM of 4th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2004), Jyväskylä Finland 2004年  

Calculation of Mixed-Mode Stress Intensity Factors for Crack Propagation using Element-Free Galerkin Method 

Proceedings CD-ROM of 4th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2004), Jyväskylä Finland 2004年  

Stress Intensity Factors Analysis of an Interface Crack between Anisotropic Dissimilar Materials under Thermal Stress 

Proceedings of European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2004) CD-ROM 2004年  

Evaluation of Residual Stress in Resin Molding IC Chips using FEM 

Proceedings of International Conference on Electronics Packaging (ICEP 2004) 223-226 2004年  

Reliability Evaluation of Interconnection Using Anisotropic Conductive Adhesive Films (Effects of ACF Resins, Substrates and Bump-Heights) 

Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004) pp. 488-493 2004年  

Mechanical Reliability of Anisotropic Conductive Adhesive Films under Moisture/Reflow Sensitivity Test 

Proceedings CD-ROM of the Sixth World Congress on Computational Mechanics in conjunction with the Second Asian-Pacific Congress on Computational Mechanics R501, pp. 1-10 2004年  

Damage Analysis of a Crack in a Thin Adhesive Layer between Hard Adherends 

Proceedings of the 11th US-Japan Conference on Composite Materials Adhe 3-1, pp. 1-4 2004年  

Nodal Relocation Method Applied to Adaptive Analysis of Meshfree Mthod 

Proceedings CD-ROM of 4th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2004), Jyväskylä Finland 2004年