論文

査読有り
2011年12月

Solid- and liquid-solid reactions in aluminum-coated titanium substrate fabricated by using explosive energy

Materials Transactions
  • Yasuhiro Morizono
  • ,
  • Tomofumi Fukuyama
  • ,
  • Tomofumi Fukuyama
  • ,
  • Mitsuhiro Matsuda
  • ,
  • Sadahiro Tsurekawa

52
開始ページ
2178
終了ページ
2183
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.2320/matertrans.M2011228

A Ti plate coated with an Al foil with a thickness of 100 μm was prepared by using explosive energy. The bonding was momentarily achieved without breaking the Al foil. This Al-coated Ti plate was heated between 898 and 1273K in the air to investigate interfacial reactions in solid Al/solid Ti and liquid Al/solid Ti states from the viewpoint of diffusion coating for Ti materials. At 898 K, a continuous Al 3 Ti layer was formed along the interface. Although the Al foil was almost replaced by Al 3 Ti in a holding time of more than 32.4 ks, many defects such as void and crack were observed in the Al 3 Ti layer. It is noteworthy that the thickness of the Al 3 Ti layer increases in proportion to the holding time in the early stage, and then, to the square root of the holding time. On the other hand, the specimen, which was heated at a temperature above the melting point of Al, showed a porous structure of Al 3 Ti via an Al + Al 3 Ti duplex state. The holding time to produce the porous structure became short with increasing heating temperature. It is expected that the Al + Al 3 Ti duplex structure is more beneficial as a surface coating layer formed by the interfacial reaction. To replace the Al foil region by such a duplex structure, continuous heat treatment was performed between 1023 and 1073 K. There were no defects in the Al + Al 3 Ti duplex region on the Ti plate, and its maximum Vickers hardness was approximately 3 times higher than that of the Ti plate. © 2011 The Japan Institute of Metals.

リンク情報
DOI
https://doi.org/10.2320/matertrans.M2011228
URL
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84858312070&origin=inward
ID情報
  • DOI : 10.2320/matertrans.M2011228
  • ISSN : 1345-9678
  • SCOPUS ID : 84858312070

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