2017年7月26日
Fully-integrated, fully-differential 3-axis tactile sensor on platform LSI with TSV-based surface-mountable structure
TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
- ,
- ,
- ,
- ,
- ,
- ,
- ,
- ,
- ,
- 開始ページ
- 500
- 終了ページ
- 503
- 記述言語
- 英語
- 掲載種別
- 研究論文(国際会議プロシーディングス)
- DOI
- 10.1109/TRANSDUCERS.2017.7994095
- 出版者・発行元
- Institute of Electrical and Electronics Engineers Inc.
The present paper reports a 2.8-mm-square surface-mountable MEMS-on-LSI integrated 3-axis tactile sensor for robot applications, which incorporates sensing and signal processing in a single chip. The MEMS part has a quad-seesaw-electrode structure for fully-differential capacitive 3-axis force sensing. The LSI is an original sensor platform LSI equipped with deep annular-type through silicon vias (TSVs). A multi-project LSI wafer was processed after fabrication in an LSI foundry. The MEMS part and the LSI part were integrated by Au-Au thermocompression bonding. The output is a digital packet and is transferred through the TSV and a bus line. A working test successfully demonstrated the fully-differential capacitive 3-axis force sensing of the fully-integrated tactile sensor.
- リンク情報
- ID情報
-
- DOI : 10.1109/TRANSDUCERS.2017.7994095
- ISBN : 9781538627310
- SCOPUS ID : 85029372854