稲見 隆

EBSD Analysis of Microstructures Along the Depth Direction in Very Narrow Cu Wires 

ELECTROCHEMISTRY 81(4) 246-250 2013年4月  

Development of the grain size evaluating process in very narrow Cu interconnects 

ECS Electrochemistry Letters 2(11) D49-D51 2013年  

Evaluation of Grain Size Distributions of 50nm Wide Cu Interconnects by X-ray Diffraction Method 

PROCESSING MATERIALS OF 3D INTERCONNECTS, DAMASCENE AND ELECTRONICS PACKAGING 4 50(32) 57-60 2013年  

Evaluation of Grain Size Distributions of Cu Interconnects with less than 100nm Width by X ray Diffraction Method 

PROCESSING MATERIALS OF 3D INTERCONNECTS, DAMASCENE AND ELECTRONICS PACKAGING 41(43) 11-14 2012年  

Development of a nondestructive method utilizing X-ray diffraction for the evaluation of grain size distributions of Cu interconnects 

Electrochemical and Solid-State Letters 14(5) H208-H211 2011年  

Development of a Nondestructive Method Utilizing X-ray Diffraction for the Evaluation of Grain Size Distributions of Cu Interconnects 

ELECTROCHEMICAL AND SOLID STATE LETTERS 14(5) H208-H211 2011年  

THERMAL STABILITY OF HELIUM BUBBLES IN NANOCRYATALLINE GOLD PREPARED BY GAS DEPOSITION METHOD 

INTERNATIONAL JOURNAL OF MODERN PHYSICS B 24(1-2) 51-56 2010年1月  

Swift heavy ion irradiation effects in nanocrystalline gold 

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS 245(1) 171-175 2006年4月  

固体炭素による酸化鉄還元TEM内その場観察 

鉄と鋼 92(11) 690-692 2006年  

In-situ observation of the reduction of iron oxides by solid state carbon in TEM 

ISIJ INTERNATIONAL 46(7) 1106-1107 2006年  

TEM observation of the reduction of wustite by hydrogen ion implantation 

ISIJ INTERNATIONAL 44(12) 2029-2032 2004年