論文

査読有り
1996年

Curing behavior of wood adhesives under high-pressure steam III. Bonding strength of phenolic resin

Mokuzai Gakkaishi/Journal of the Japan Wood Research Society
  • Kenji Umemura
  • ,
  • Hiroki Tanaka
  • ,
  • Yasushi Mizuno
  • ,
  • Shuichi Kawai

42
10
開始ページ
985
終了ページ
991
記述言語
英語
掲載種別
研究論文(学術雑誌)

This paper deals with the bonding performance of phenol-formaldehyde (PF) resin in steam-injection heating at 160°C; the effects of additives and steam-injection time on bonding strength were studied. In addition, suitable bonding condition for PF resin in steam-injection heating was investigated. The results are summarized as follows: as steam-injection time increased, the bonding strengths of 3-ply plywood, glued with a neat PF resin and wheat flour extended PF resin after cyclic boiling treatment decreased. The reason seemed that swelling, dilution, and over-penetration of PF resin took place in long steam-injection heating. With sodium carbonate-added resin, the bonding strength increased gradually with increasing steam-injection time. To improve the bonding strength in a short heating time, intermittent steam-injection heating was tried. When a neat resin and sodium carbonate-added resin were used, the bonding strengths were improved dramatically. Therefore, intermittent steam-injection heating was effective for the development of the bonding strength of PF resin.

リンク情報
J-GLOBAL
https://jglobal.jst.go.jp/detail?JGLOBAL_ID=200902107691759246
Scopus
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=20544447715&origin=inward
Scopus Citedby
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ID情報
  • ISSN : 0021-4795
  • J-Global ID : 200902107691759246
  • SCOPUS ID : 20544447715

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