2008年
Effect of Magnetic Field on Copper Electroplating-Application to Through-Hole Plating
J. Surf. Finish. Soc. Jpn.
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- 巻
- 59
- 号
- 6
- 開始ページ
- 408
- 終了ページ
- 414
- 記述言語
- 日本語
- 掲載種別
- DOI
- 10.4139/sfj.59.408
- 出版者・発行元
- 一般社団法人 表面技術協会
In a magnetic field, an electrochemical reaction generates a macroscopic solution flow called MHD flow by the Lorentz force, which enhances mass transfer in the diffusion layer (MHD effect). In electroplating, the MHD effect comes from two-dimensional (2D) nucleation in an electrical double layer accompanied by the unstable growth of non-equilibrium fluctuations (called asymmetrical fluctuations). Electroplating under a magnetic field provides the other magnetic field effect called the micro-MHD effect, which emerges with micro-MHD flow and symmetrical non-equilibrium fluctuations in a diffusion layer, and suppresses three-dimensional (3D) nucleation. That is to say, the MHD effect acts as a positive catalyst, whereas the micro-MHD effect is employed as a negative catalyst, or inhibitor. Furthermore, owing to the strong penetration of the magnetic field into the materials, micro-MHD flows are effectively induced even in the inside of a complicated minute structure. Therefore, by controlling the magnetic field, we can expect high quality plating in the through-hole plating. In this paper, along with its application to through-hole plating, copper magneto-electroplating is examined from various aspects.
- リンク情報
- ID情報
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- DOI : 10.4139/sfj.59.408
- ISSN : 0915-1869
- ISSN : 1884-3409
- CiNii Articles ID : 10021170217
- CiNii Books ID : AN1005202X