大竹浩人 (Hiroto Ohtake) - マイポータル

基本情報

所属: 旧所属東北大学流体科学研究所附属流体融合研究センター講師

J-GLOBAL ID: 200901065446199520
researchmap会員ID: 5000103406

委員歴

2007年 - 2007年

The international symposium on AFI/TFI 2007, 実行委員
2007年

The international conference on Solid State Devices and Materials, 実行委員
2004年

ドライプロセスシンポジウム国際学会, 論文委員

MISC

Structure-designable method to form super low-k SiOC film (k=2.2) by neutral-beam-enhanced chemical vapour deposition

Shigeo Yasuhara, Juhyun Chung, Kunitoshi Tajima, Hisashi Yano, Shingo Kadomura, Masaki Yoshimaru, Noriaki Matsunaga, Tomohiro Kubota, Hiroto Ohtake, Seiji Samukawa

JOURNAL OF PHYSICS D-APPLIED PHYSICS 42(5) 055208-1-055208-7 2009年3月
Real-time monitoring of successive sparks in high-density plasma chambers

Michio Sato, Hiroto Ohtake, Koichi Suzuki, Seiji Samukawa

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 25(6) 1594-1598 2007年11月
On-wafer monitoring of charge accumulation and sidewall conductivity in high-aspect-ratio contact holes during SiO2 etching process

Butsurin Jinnai, Toshiyuki Orita, Mamoru Konishi, Jun Hashimoto, Yoshinari Ichihashi, Akito Nishitani, Shingo Kadomura, Hiroto Ohtake, Seiji Samukawa

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 25(6) 1808-1813 2007年11月
Feasibility study of 45-nm-node scaled-down Cu interconnects with molecular-pore-stacking (MPS) SiOCH films

Munehiro Tada, Hiroto Ohtake, Fuminori Ito, Mitsuru Narihiro, Toshiji Taiji, Yoshiko Kasama, Tsuneo Takeuchi, Kouichi Arai, N. Furutake, Noriaki Oda …

IEEE TRANSACTIONS ON ELECTRON DEVICES 54(4) 797-806 2007年4月
On-wafer monitoring of electron and ion energy distribution at the bottom of contact hole

Hiroto Ohtake, Butsurin Jinnai, Yuya Suzuki, Shinnosuke Soda, Tadashi Shimmura, Seiji Samukawa

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 25(2) 400-403 2007年3月
Robust Cu dual damascene interconnects with porous SiOCH films fabricated by low-damage multi-hard-mask etching technology

Hiroto Ohtake, Masayoshi Tagami, Munehiro Tada, Makoto Ueki, Mari Abe, Shinobu Saito, Fuminori Ito, Yoshihiro Hayashi

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING 19(4) 455-464 2006年11月
Real-time monitoring of charge accumulation during pulse-time-modulated plasma

Hiroto Ohtake, Butsurin Jinnai, Yuya Suzuki, Shinnosuke Soda, Tadashi Shimmura, Seiji Sarnukawa

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 24(6) 2172-2175 2006年11月
Robust porous SiOCH/Cu interconnects with ultrathin sidewall protection liners

M Tada, T Tamura, F Ito, H Ohtake, M Narihiro, M Tagami, M Ueki, K Hijioka, M Abe, N Inoue …

IEEE TRANSACTIONS ON ELECTRON DEVICES 53(5) 1169-1179 2006年5月
Low-loss LSI Interconnects on Novel “Partially Low-k Plugged Si Substrate” (PLP-Sub) for RF/ubiquitous Applications

Proceedings of the International Interconnect Technology Conference ,60-62 2006年
A Metallurgical Prescription for Electromigration (EM) Reliability Improvement in Scaled-down, Cu Dual Damascene Interconnects

Proceedings of the International Interconnect Technology Conference ,89-91 2006年
High Performance High-k MIM Capacitor with Plug-in Plate (PiP) for Power Delivery Line of High-Speed MPUs

Proceedings of the International Interconnect Technology Conference ,63-65 2006年
High Performance SiN-MIM Decoupling Capacitors with Surface-smoothed Bottom Electrodes for High-speed MPUs

Extended Abstract of the 2006 International Conference on Solid State Device and Materials ,1026-1027 2006年
High-performance Cu-interconnects with Novel Seamless Low-k SiOCH Stacks (SEALS) Featured by Compositional Modulation Process for 45 nm-node ULSI Devices

2006 Symposium on VLSI Technology Digest of Technical Paper ,108-109 2006年
Low-loss LSI Interconnects on Novel “Partially Low-k Plugged Si Substrate” (PLP-Sub) for RF/ubiquitous Applications

Proceedings of the International Interconnect Technology Conference ,60-62 2006年
A Metallurgical Prescription for Electromigration (EM) Reliability Improvement in Scaled-down, Cu Dual Damascene Interconnects

Proceedings of the International Interconnect Technology Conference ,89-91 2006年
High Performance High-k MIM Capacitor with Plug-in Plate (PiP) for Power Delivery Line of High-Speed MPUs

Proceedings of the International Interconnect Technology Conference ,63-65 2006年
High Performance SiN-MIM Decoupling Capacitors with Surface-smoothed Bottom Electrodes for High-speed MPUs

Extended Abstract of the 2006 International Conference on Solid State Device and Materials ,1026-1027 2006年
High-performance Cu-interconnects with Novel Seamless Low-k SiOCH Stacks (SEALS) Featured by Compositional Modulation Process for 45 nm-node ULSI Devices

2006 Symposium on VLSI Technology Digest of Technical Paper ,108-109 2006年

大竹浩人

基本情報

委員歴

MISC

所属学協会

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