論文

査読有り 筆頭著者 責任著者
2015年5月

High-efficient regeneration of grinding performance using adhesive films in dry grinding of carbon

Key Engineering Materials
  • Kazuhito Ohashi
  • ,
  • Yuya Takata
  • ,
  • Shinya Tsukamoto

656-657
開始ページ
283
終了ページ
288
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.4028/www.scientific.net/KEM.656-657.283
出版者・発行元
Trans Tech Publications Ltd

© (2015) Trans Tech Publications, Switzerland. The grinding performance of wheel remarkably decreases by the wheel loading in dry grinding of precision hard carbon parts. When the wheel loading occurs, the dressing is carried out to remove loading chips for generation of the grinding performance. However, many abrasive grains, which have enough cutting ability under loading chips, are removed in dressing. We therefore have developed the wheel surface cleaning using adhesive films without dressing to remove loading carbon chips on wheel surfaces in our previous reports, and the cleaning could achieve the lean regeneration of grinding performance of fine grade diamond wheels. The removing ability of loading chips is improved by increasing the peeling speed of adhesive film, the pressing time of adhesive films or the number of pressing time. However the optimum cleaning condition has not been investigated. In this report, from the viewpoint of efficiency in the treatment, we therefore investigate the optimum rolling press process of adhesive film on loading disc wheel surfaces in dry grinding of carbon. The optimum treatment processes are experimentally made clear, analyzing SPa of cleaned wheel surfaces, which is one of surface roughness parameters having the correlation with the protrusion height of abrasive grains. Furthermore, the effect of the treatment on regeneration of grinding performance is experimentally verified by grinding tests of hard carbons.

リンク情報
DOI
https://doi.org/10.4028/www.scientific.net/KEM.656-657.283
Scopus
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84952309763&origin=inward
Scopus Citedby
https://www.scopus.com/inward/citedby.uri?partnerID=HzOxMe3b&scp=84952309763&origin=inward
ID情報
  • DOI : 10.4028/www.scientific.net/KEM.656-657.283
  • ISSN : 1013-9826
  • eISSN : 1662-9795
  • SCOPUS ID : 84952309763

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