NAKAGAWA Shinji

J-GLOBAL         Last updated: Feb 12, 2019 at 21:13
 
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Name
NAKAGAWA Shinji
Affiliation
Toyama Prefectural University
Job title
Associate Professor
Degree
Dr Eng(Doshisha University), (BLANK)(Doshisha University)

Research Areas

 
 

Academic & Professional Experience

 
2001
 - 
2003
Aoyama Gakuin University, Research Associate
 
1999
 - 
2001
University of Illinois, Post-Doctoral Research Associate
 

Education

 
 
 - 
1999
Graduate School, Division of Engineering, Doshisha University
 
 
 - 
1993
Faculty of Engineering, Doshisha University
 

Published Papers

 
Yoshinori Aruga, Takayuki Yamabe, Koichi Hirasawa, Hirotoshi Aoki, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Transactions of The Japan Institute of Electronics Packaging   11 E18-005-1-E18-005-13   Dec 2018   [Refereed]
Risako Kibushi, Tomoyuki Hatakeyama, Kazuhisa Yuki, Shinji Nakagawa, Masaru Ishizuka
Transactions of The Japan Institute of Electronics Packaging   10 E16-016-1-E16-016-6   2017   [Refereed]
Y. Aruga K. Hirasawa H. Aoki T. Hatakeyama S. Nakagawa M. Ishizuka
Transactions of The Japan Institute of Electronics Packaging, Vol. 10, E16-012 (2017)      2017   [Refereed]
伊熊克典, 中川慎二, 稲岡恭二, 千田衞
同志社大学ハリス理化学研究報告   56(4) 266‐274   Jan 2016
西剛伺, 畠山友行, 中川慎二, 石塚勝
エレクトロニクス実装学会誌   18(3) 167-178   May 2015
Yafei Luo, Yafei Luo, Yasushi Kajita, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Journal of Japan Institute of Electronics Packaging   18 161-166   Jan 2015
The distribution of heat flux in power MOSFET package is significantly affected by the effective heating area of MOSFET chip. Under different operation conditions, power consumption distribution changes due to MOSFET's different temperature sensit...
Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Transactions of The Japan Institute of Electronics Packaging   8(1) 55-61   2015   [Refereed]
Yafei Luo, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Journal of Japan Institute of Electronics Packaging   17 307-311   Jul 2014
福江高志, 石塚勝, 山崎健太, 畠山友行, 中川慎二, 中山恒
Therm Sci Eng   19(3) 81-93   Jul 2011
福江高志, 石塚勝, 中川慎二, 畠山友行, 下内智也, 中山恒
日本機械学会論文集 B編   76(771) 1884-1892   Nov 2010

Misc

 
Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels   1    Jan 2015
Copyright © 2015 by ASME. This paper describes the effect of variation of energy relaxation time on temperature distribution of power Si MOSFET in electro-thermal analysis. In previous our studies, thermal properties of power Si MOSFET are evaluat...
Kuniya Azuma, Tomoyuki Hatakeyama, Shinji Nakagawa
ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference   381-384   Jan 2015
© 2015 The Japan Institute of Electronics Packaging. Recently, thermal design of electrical equipment is important. Thermal contact resistance is one of the important parameters in the thermal design. However, thermal contact resistance is depende...
Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014   341-344   Jan 2014
© 2014 IEEE. This paper describes the effect of variation of doping density on thermal properties of power Si MOSFET. For accurate thermal design according to miniaturization of electronics, we should consider thermal properties of semiconductor d...
Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
2014 International Conference on Electronics Packaging, ICEP 2014   567-571   Jan 2014
This paper describes the effect of the boundary condition at the bottom surface of the power Si MOSFET on the analysis results of electro-thermal analysis of the power Si MOSFET. In general, the bottom surface of a semiconductor device is assumed ...
Koji Nishi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference   982-989   Jan 2014
© 2014 IEEE. This paper investigates transient temperature prediction of microprocessor hot spot by utilizing one-dimensional thermal network with average temperature nodes. Different from traditional thermal network, introduced one-dimensional th...
K. Nishi, T. Hatakeyama, S. Nakagawa, M. Ishizuka
2014 International Conference on Electronics Packaging, ICEP 2014   585-590   Jan 2014
This paper explores and investigates tablet device with slate style chassis by utilizing one-dimensional thermal network expression. Thermal network is constructed from results by heat conduction simulation to well understand root causes of hot sp...
Yafei Luo, Yafei Luo, Yasushi Kajita, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Proceedings of the 15th International Heat Transfer Conference, IHTC 2014      Jan 2014
The distribution of heat flux in power MOSFET package is significantly affected by the effective heating area of MOSFET chip. Under different operation conditions, effective heating area changes depending on MOSFET's working condition. In case whe...
K. Nishi, T. Hatakeyama, S. Nakagawa, M. Ishizuka
Proceedings of the 15th International Heat Transfer Conference, IHTC 2014      Jan 2014
This paper explores transient thermal behavior of the microprocessor system. Thermal control is becoming critical and transient thermal analysis is becoming highly important for system development of portable electronic equipment. Deep understandi...
Dai Imai, Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
2014 International Conference on Electronics Packaging, ICEP 2014   60-63   Jan 2014
Recently, a high accuracy soldering method is required. Then, laser soldering has attracted attention. In laser soldering, it is difficult to detect an optimal laser condition depending on production conditions, because the amount of heat transfer...
Yafei Luo, Yafei Luo, Yasushi Kajita, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
2014 International Conference on Electronics Packaging, ICEP 2014   596-599   Jan 2014
The heat flow distribution in IGBT package is significantly affected by its interfacing materials and dimension of metal frame. In order to increase heat-sink capability which is critical for kW IGBT device, lateral heat spreading technology is in...

Conference Activities & Talks

 
Yoshinori Aruga, Koichi Hirasawa, Takayuki Yamabe, Hirotoshi Aoki, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018   6 Jun 2018   
© 2018 Japan Institute of Electronics Packaging. In this paper, a method of estimating the temperature of densely mounted chip components was discussed. The temperature distribution and heat flow inside the pad under various pad conditions was inv...
Thomas Schiano, Thomas Schiano, Ryohei Hirose, Keisuke Iida, Miho Seike, Tomoyuki Hatakeyama, Shinji Nakagawa
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018   6 Jun 2018   
© 2018 Japan Institute of Electronics Packaging. Because of the increase of heat generation density and high-density packaging, the limits of air cooling are being reached and demand for liquid cooling systems for electronics is increasing. Utiliz...
Yoshinori Aruga, Koichi Hirasawa, Takayuki Yamabe, Hirotoshi Aoki, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
2017 IEEE CPMT Symposium Japan, ICSJ 2017   26 Dec 2017   
© 2017 IEEE. In this paper, The relationship between the temperature rise of the heat generating components densely mounted in a grid pattern on the board and the various board design conditions was discussed. Based on the discussion, a simple est...
Yoshinori Aruga, Koichi Hirasawa, Hirotoshi Aoki, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
2017 International Conference on Electronics Packaging, ICEP 2017   5 Jun 2017   
© 2017 Japan Institute of Electronics Packaging. In this paper, temperature estimation method of heat-generating components in dense mounting was discussed. Specifically, simulation of components arranged densely in a grid pattern on a PCB was car...
水谷光二朗, 中川慎二, 寺澤弘泰
日本機械学会北陸信越支部総会・講演会講演論文集(CD-ROM)   8 Mar 2017   

Works

 
Fundamental research on thermal energy storage to preserve environment
2001

Research Grants & Projects

 
Turbulence structure over a structured surface
The Other Research Programs
Natural Convection with Interface
The Other Research Programs
Freezing of Super-cooling solution under natural convection
The Other Research Programs