2009
Effective Features for Defective Soldering Detection by Image Analysis
ITE Technical Report
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- Volume
- 33
- Number
- First page
- 5
- Last page
- 8
- Language
- Japanese
- Publishing type
- DOI
- 10.11485/itetr.33.31.0_5
- Publisher
- The Institute of Image Information and Television Engineers
In the optical soldering inspection systems, the existence or nonexistence of soldering paste and unfirm solder are relatively easy to be detected. However, it is difficult to classify the amount, the shape and the state of the fillet of brazed joints. This study aims at a development of an automatic classification system of solder joints on printed circuit boards and an exploration of effective features for defective soldering detection by means of statistical image analysis of digital images. A number of features are selected from textural features to be tested for the classification into 5 typical classes of solder joints. Experiments have shown that they are effective.
- Link information
- ID information
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- DOI : 10.11485/itetr.33.31.0_5
- CiNii Articles ID : 130006085279