Papers

2009

Effective Features for Defective Soldering Detection by Image Analysis

ITE Technical Report
  • SUGIYAMA Kentaro
  • ,
  • MIYAGUCHI Tatsuya
  • ,
  • KIKUCHI Hisakazu
  • ,
  • MURAMATSU Shogo
  • ,
  • KOBAYASHI Jun-ichi

Volume
33
Number
First page
5
Last page
8
Language
Japanese
Publishing type
DOI
10.11485/itetr.33.31.0_5
Publisher
The Institute of Image Information and Television Engineers

In the optical soldering inspection systems, the existence or nonexistence of soldering paste and unfirm solder are relatively easy to be detected. However, it is difficult to classify the amount, the shape and the state of the fillet of brazed joints. This study aims at a development of an automatic classification system of solder joints on printed circuit boards and an exploration of effective features for defective soldering detection by means of statistical image analysis of digital images. A number of features are selected from textural features to be tested for the classification into 5 typical classes of solder joints. Experiments have shown that they are effective.

Link information
DOI
https://doi.org/10.11485/itetr.33.31.0_5
CiNii Articles
http://ci.nii.ac.jp/naid/130006085279
ID information
  • DOI : 10.11485/itetr.33.31.0_5
  • CiNii Articles ID : 130006085279

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