論文

1986年8月1日

異種ぜい性材料接合部材の破損確率(<特集>セラミックスの微細構造)

窯業協會誌
  • 中村 守
  • ,
  • 伊藤 正治
  • ,
  • 大司 達樹
  • ,
  • 平井 幸男
  • ,
  • 金山 公三
  • ,
  • 田端 英世

94
1092
開始ページ
926
終了ページ
930
記述言語
英語
掲載種別
DOI
10.2109/jcersj1950.94.1092_926
出版者・発行元
公益社団法人日本セラミックス協会

The influence of thermal stress in joints, which is induced during cooling by the difference in thermal expansion coefficient between the joined brittle materials, on the failure probabilities of the joints was estimated. A numerical analysis by the finite-element method was carried out on SiC/Si&lt;sub&gt;3&lt;/sub&gt;N&lt;sub&gt;4&lt;/sub&gt; joints. It was assumed that the strength of each material obeys the Weibull distribution function and that the joining strength is high enough to prevent rupture at the joining interface. Since the tensile stress develops predominantly at the side of SiC which has a larger thermal expansion coefficient than that of Si&lt;sub&gt;3&lt;/sub&gt;N&lt;sub&gt;4&lt;/sub&gt;, the Weibull modulus of SiC was taken into consideration for calculating the failure probability of the joint. The dimension of the joint and the Weibull modulus of SiC member were shown to have great influence on the failure probability. Therefore, these two factors must be taken into consideration in addition to the fracture strength of material to be joined for the evaluation of the joining strength of various brittle materials.

リンク情報
DOI
https://doi.org/10.2109/jcersj1950.94.1092_926
CiNii Articles
http://ci.nii.ac.jp/naid/110002313517
CiNii Books
http://ci.nii.ac.jp/ncid/AN00245650
ID情報
  • DOI : 10.2109/jcersj1950.94.1092_926
  • ISSN : 1884-2127
  • CiNii Articles ID : 110002313517
  • CiNii Books ID : AN00245650
  • identifiers.cinii_nr_id : 9000003630360

エクスポート
BibTeX RIS