論文

査読有り
2018年4月1日

Evaluation of Thermal Strain Induced in Components of Nb3Sn Strand during Cooling

IEEE Transactions on Applied Superconductivity
  • Tomone Suwa
  • ,
  • Tsutomu Hemmi
  • ,
  • Toru Saito
  • ,
  • Yoshikazu Takahashi
  • ,
  • Koizumi Norikiyo
  • ,
  • Vladimir Luzin
  • ,
  • Hiroshi Suzuki
  • ,
  • Stefanus Harjo

28
3
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1109/TASC.2018.2793190
出版者・発行元
Institute of Electrical and Electronics Engineers Inc.

Nb3Sn strands, whose properties are very sensitive to stress/strain, are utilized for ITER cable-in-conduit conductor (CICC) of the central solenoids. The Nb3Sn strands experience temperature range of ∼1000 K from the temperature of the heat treatment with the initiation of the Nb3Sn reaction to the operation temperature of ∼4 K. Due to this large temperature range, large thermal strain is induced in the Nb3Sn filaments due to the differences between the coefficients of thermal expansion and Young's moduli of the components of the strand. Therefore, it is considered that initial performance of the CICC is influenced by the thermal strain on the Nb3Sn, and it is important to evaluate the strain state of the Nb3 Sn strand at low temperature. In this study, the thermal strain of the components of free Nb3Sn strand was measured by neutron diffraction and stress/strain state was assessed from room temperature to low temperature. As the results of diffraction measurements, it was found that 0.111% and 0.209% compressive strain were generated in Nb3Sn filaments at 300 and 10 K, respectively.

Web of Science ® 被引用回数 : 1

リンク情報
DOI
https://doi.org/10.1109/TASC.2018.2793190
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000427237400001&DestApp=WOS_CPL
Scopus
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85041215576&origin=inward
Scopus Citedby
https://www.scopus.com/inward/citedby.uri?partnerID=HzOxMe3b&scp=85041215576&origin=inward
ID情報
  • DOI : 10.1109/TASC.2018.2793190
  • ISSN : 1051-8223
  • SCOPUS ID : 85041215576
  • Web of Science ID : WOS:000427237400001

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