2020年1月
Smart optical measurement probe for autonomously detecting nano-defects on bare semiconductor wafer surface: Verification of proposed concept
Precision Engineering
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- 巻
- 61
- 号
- 開始ページ
- 93
- 終了ページ
- 102
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1016/j.precisioneng.2019.09.019
© 2019 Elsevier Inc. We propose a new method of inspecting a surface for fine defects that combines the optical inspection method with observation of the physical behavior of a liquid. A liquid thin film on a substrate behaves as a near-field physical probe that autonomously captures nano-particulate defects. Optical observation of the interfacial behavior of the liquid thin film is used to detect minute defects. This method combines the characteristics of optical detection (i.e., detection from a remote field and simultaneous detectability on a plane) and the high sensitivity of a physical near-field probe. We examined the basic principles of the proposed method through numerical calculation and applied it in experiments to detect fine particulate defects on a silicon substrate for semiconductor manufacturing to demonstrate the validity of the basic concept of the proposed method.
- リンク情報
- ID情報
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- DOI : 10.1016/j.precisioneng.2019.09.019
- ISSN : 0141-6359
- ORCIDのPut Code : 82202433
- SCOPUS ID : 85073590362