論文

査読有り
2019年6月

Ultra-Thin Lightweight Bendable Crystalline Si Solar Cells for Solar Vehicles

Conference Record of the IEEE Photovoltaic Specialists Conference
  • Yoshio Ohshita
  • Kohei Onishi
  • Ryo Yokogawa
  • Tappei Nishihara
  • Takefumi Kamioka
  • Kyotaro Nakamura
  • Tomoyuki Kawatsu
  • Toshiki Nagai
  • Noboru Yamada
  • Yukio Miyashita
  • Atsushi Ogura
  • 全て表示

開始ページ
1131
終了ページ
1134
記述言語
掲載種別
研究論文(国際会議プロシーディングス)
DOI
10.1109/PVSC40753.2019.8981291

© 2019 IEEE. Komatsu NTC developed ultra-thin wafer slicing with low kerf-loss by multi diamond-wire saw. We modified slicing conditions and diamond-wire specifications to keep the straightness of wire for the fine pitch slicing and established 150 μm pitch slicing technology. The as-cut wafer thickness is 90 μm, and the kerf-loss is 60 μm. As a result, the highly flexible ultrathin wafer can be obtained with well-controlled surface crystallinity. The PERT cell fabrication trial using ultra-thin wafers showed that the relative deference of cell efficiency between 166 μm thick and 84 μm thick solar cells was just only 1.2%.

リンク情報
DOI
https://doi.org/10.1109/PVSC40753.2019.8981291
Scopus
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85081556248&origin=inward
Scopus Citedby
https://www.scopus.com/inward/citedby.uri?partnerID=HzOxMe3b&scp=85081556248&origin=inward
ID情報
  • DOI : 10.1109/PVSC40753.2019.8981291
  • ISSN : 0160-8371
  • SCOPUS ID : 85081556248

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