論文

査読有り
2017年7月26日

20 Milliwatt class ultralow power integrated OCXO using polyimide and thin film metal connection suspended in vacuum packaging

TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
  • Takanori Suzuki
  • ,
  • Masanori Muroyama
  • ,
  • Tomoyuki Taira
  • ,
  • Noritoshi Kimura
  • ,
  • Takashiro Tsukamoto
  • ,
  • Shuji Tanaka

開始ページ
435
終了ページ
438
記述言語
英語
掲載種別
研究論文(国際会議プロシーディングス)
DOI
10.1109/TRANSDUCERS.2017.7994080
出版者・発行元
Institute of Electrical and Electronics Engineers Inc.

This paper proposes a 20 mW class low-power and miniaturized oven controlled crystal oscillator (OCXO) by combination of the following two methods. (1) A crystal resonator and a CMOS-LSI for oscillation and oven control circuits are integrated for realizing an integrated OCXO chip. (2) The integrated chip is connected with thin film metal interconnection on a thin polyimide film and is suspended by an ultrasonic bonding technique in vacuum packaging. Based on the thermal analysis, we designed the thermally isolated connection. Experimental results showed that the fabricated OCXO successfully saved about 90% power consumption compared with the existing wire bonding implementation.


リンク情報
DOI
https://doi.org/10.1109/TRANSDUCERS.2017.7994080
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000426701400108&DestApp=WOS_CPL

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