Toshiyuki Kondo

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Thickness dependency of creep crack propagation mechanisms in submicrometer-thick gold films investigated using in situ FESEM and EBSD analysis

Toshiyuki Kondo, Hiroyuki Inoue, Kohji Minoshima

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 790 Jul, 2020
Influence of a thin surface oxide layer on fracture toughness of copper films

Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics Oct, 2019 Peer-reviewed
Electron-beam enhanced creep deformation of amorphous silicon nano-cantilever

Hiroyuki Hirakata, Kenta Konishi, Toshiyuki Kondo, Kohji Minoshima

JOURNAL OF APPLIED PHYSICS 126(10) 105102-1 - 105102-10 Sep, 2019 Peer-reviewed
Effects of surface oxide layer on fracture toughness of submicrometer-thick freestanding copper films

Toshiyuki Kondo, Daiki Miki, Hiroyuki Hirakata, Kohji Minoshima

Engineering Fracture Mechanics 220 106652-1 - 106652-9 Aug, 2019 Peer-reviewed
Vacuum effects on fatigue crack growth in submicrometre-thick freestanding copper films

Toshiyuki KONDO, Akihiro SHIN, Masayuki SAKIHARA, Hiroyuki HIRAKATA, Kohji MINOSHIMA

Fatigue & Fracture of Engineering Materials & Structures 42 1118 - 1129 Jan, 2019 Peer-reviewed

サブミクロン単結晶金薄膜のその場 FESEM 観察引張・クリープ試験

近藤俊之, 高山篤史, 箕島弘二

Nov, 2019
Stress-induced chemical reaction of Ti/Si multilayered nano-films

Hiroyuki HIRAKATA, Takashi KAWAI, Toshiyuki KONDO, Kohji MINOSHIMA

2018 MRS Fall Meeting and Exhibits NM02.03.22 Nov, 2018 Peer-reviewed
Evaluation of Mechanical Properties of Submicometer-thick Copper Thin Film Using Micro Tensile Specimen

MORIKUNI Tomoaki, KONDO Toshiyuki, MINOSHIMA Kohji

The Proceedings of Mechanical Engineering Congress, Japan 2018 Sep, 2018
サブミクロン銅薄膜の疲労き裂開閉口挙動に及ぼす真空環境効果

近藤俊之, 赤坂昌哉, 平方寛之, 箕島弘二

日本材料学会学術講演会講演論文集 67th 61‐62 May 25, 2018
表面酸化層を制御したサブミクロン銅薄膜の破壊じん性

三木大輝, 近藤俊之, 平方寛之, 箕島弘二

日本材料学会学術講演会講演論文集 67th 63‐64 May 25, 2018