2007年
Moving-mask UV lithography for 3-dimensional positive- and negative-tone thick photoresist microstructuring
TRANSDUCERS '07 & EUROSENSORS XXI, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2
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- 開始ページ
- 545
- 終了ページ
- 548
- 記述言語
- 英語
- 掲載種別
- DOI
- 10.1109/SENSOR.2007.4300188
- 出版者・発行元
- IEEE
This paper presents a systematic study on "Moving-mask UV lithography" for 3-D (three-dimensional) microstructuring of positive- and negative-tone thick photoresist and a dedicated UV lithography process simulation. As an application of the moving-mask UV lithography, we propose a novel method to fabricate embedded microfluidic structures Using SU-8. Furthermore, we propose a new practical photoresist profile simulation approach adopting the "Fast Marching Method" to consider the photoresist dissolution vector in the development process. Through a series of moving-mask UV lithography experiments, (1) the capability of the moving-mask UV lithography for 3-D microstructuring, and (2) the validity of the proposed photoresist profile simulation, were successfully confirmed.
- リンク情報
- ID情報
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- DOI : 10.1109/SENSOR.2007.4300188
- Web of Science ID : WOS:000249603700132