MISC

査読有り
2008年

DNA mediated sequential self-assembly of nano/micro components

MEMS 2008: 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST
  • T. Kusakabe
  • ,
  • T. Tanemura
  • ,
  • Y. Higuchi
  • ,
  • K. Sugano
  • ,
  • T. Tsuchiya
  • ,
  • O. Tabata

開始ページ
1052
終了ページ
1055
記述言語
英語
掲載種別
DOI
10.1109/MEMSYS.2008.4443840
出版者・発行元
IEEE

A novel sequential self-assembly process of nano/micro components applying deoxyribonucleic acid (DNA) hybridization was proposed for the first time and its validity was experimentally verified. In the proposed process, characteristics of DNA, such as hybridization specificity of complementary pairs of single-stranded DNA (ssDNA) into a double-stranded DNA (dsDNA), and the dependence of hybridization on ambient temperature (melting temperature T.) plays a key role. These characteristics of DNA can be designed and synthesized by base-pair sequence of DNA. Three types of self-assembly experiments using two types of ssDNA with different T,, (65 degrees C and 50 degrees C) were carried out; 1) between Au nanoparticles, 2) between An nanoparticle and Au coated substrate, and 3) between Silicon micro components (5 x 5 x 3 mu m(3)) and Au coated substrate. Through these experiments, it was successfully verified that the sequence of the self-assembly can be controlled by controlling the ambient temperature. The reversibility of this process was also confirmed. However, the Silicon micro components assembly on Au coated substrate was not confirmed.

リンク情報
DOI
https://doi.org/10.1109/MEMSYS.2008.4443840
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000253356900263&DestApp=WOS_CPL
ID情報
  • DOI : 10.1109/MEMSYS.2008.4443840
  • ISSN : 1084-6999
  • Web of Science ID : WOS:000253356900263

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