2015年
SELECTIVE ASSEMBLY OF DNA NANOSTRUCTURE BRIDGING ONTO A TRENCHED SILICON SUBSTRATE
2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS)
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- 開始ページ
- 1389
- 終了ページ
- 1392
- 記述言語
- 英語
- 掲載種別
- DOI
- 10.1109/TRANSDUCERS.2015.7181192
- 出版者・発行元
- IEEE
We demonstrated for the first time the versatility of the previously proposed concept of DNA nanostructure integration on MEMS [1] by selectively assembling DNA nanostructures to form a bridge over a trenched silicon. A DNA origami (30 x 150 nm) was fixed to bridge a trenches (100 nm width, 200 nm depth) utilizing the hybridization between ssDNA on the DNA origami and selectively immobilized complementary ssDNA-pattern at the edges of the etched trench. An octadecylsilane self-assembled monolayer (ODS SAM) was utilized as a masking layer for a scanning probe lithography (SPL) with better process stability than a trimethylsilyl (TMS) SAM. This result opens a way to integrate the nanomaterial components on a structured device such as MEMS by using DNA origami.
- リンク情報
- ID情報
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- DOI : 10.1109/TRANSDUCERS.2015.7181192
- Web of Science ID : WOS:000380461400346