論文

査読有り
2018年6月1日

The effects of chemical components and particle size on the mechanical properties of binderless boards made from oak (Quercus spp.) logs degraded by shiitake fungi (Lentinula edodes)

Journal of Wood Science
  • Florence Hiu Yan Lui
  • ,
  • Yoko Kurokochi
  • ,
  • Hiroe Narita
  • ,
  • Yukie Saito
  • ,
  • Masatoshi Sato

64
3
開始ページ
246
終了ページ
255
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1007/s10086-018-1695-y
出版者・発行元
Springer Tokyo

Binderless boards are composite boards that rely on self-bonding mechanisms for inter-fibre bonding. Quercus acutissima and Quercus serrata logs degraded by Lentinula edodes (shiitake fungi) were used in this study to investigate whether physical and chemical changes induced by shiitake fungi can enhance board mechanical properties. Binderless boards were manufactured with 0.8 g/cm3 target density, 220 °C pressing temperature, 5 MPa pressure, and pressing duration of 10 min. Boards made from logs degraded for ≥ 26 months were stronger than control boards and met modulus of rupture (MOR) and internal bonding (IB) requirements for fibreboards. Chemical composition and particle size distribution of the wood powder used to make the boards were determined to elucidate the drivers of board mechanical properties. The proportion of small particles (&lt
150 µm) showed a strong positive correlation with MOR for both species and hot water extractives showed a strong positive correlation with IB for Q. acutissima boards. Introduction of shiitake fungi pre-treatment to the production process may enhance the mechanical strength of binderless boards.

Web of Science ® 被引用回数 : 3

リンク情報
DOI
https://doi.org/10.1007/s10086-018-1695-y
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000433193900008&DestApp=WOS_CPL
ID情報
  • DOI : 10.1007/s10086-018-1695-y
  • ISSN : 1435-0211
  • SCOPUS ID : 85042130780
  • Web of Science ID : WOS:000433193900008

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