論文

査読有り
2008年7月

Disappearance of stress singularity at interface edge due to nanostructured thin film

ENGINEERING FRACTURE MECHANICS
  • Takashi Sumigawa
  • ,
  • Hiroyuki Hirakata
  • ,
  • Masaki Takemura
  • ,
  • Shohel Matsumoto
  • ,
  • Motofumi Suzuki
  • ,
  • Takayuki Kitamura

75
10
開始ページ
3073
終了ページ
3083
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1016/j.engfracmech.2007.12.010
出版者・発行元
PERGAMON-ELSEVIER SCIENCE LTD

The purpose of this study is to examine the stress distribution near the interface between a nanostructured thin film and a solid body. We focus on a nanostructured thin film that consists of Ta2O5 helical nanosprings fabricated oil a Si substrate by dynamic oblique deposition. The mechanical properties of the thin film are obtained by vertical and lateral loading tests using a diamond tip built into an atomic force microscope. The apparent shear and Young's moduli, C and E, of the thin film are 2-3 orders of magnitude lower than those of a conventional solid Ta2O5 film. Moreover, the thin film shows strong anisotropy. A finite element analysis for two types of components with different interface edges between the thin film and,in elastic solid body is conducted under uniform displacement. One has a free edge where the surface-interface angle is 90 degrees-90 degrees, and the other has a short interface crack. These analyses indicate the absence of not only stress singularity but also high stress concentration near the free edge and the interface crack tip. The characteristic stress distributions near the interface are due to the nanoscopically discrete structure of the thin film. (c) 2008 Elsevier Ltd. All rights reserved.

リンク情報
DOI
https://doi.org/10.1016/j.engfracmech.2007.12.010
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000256014600015&DestApp=WOS_CPL
ID情報
  • DOI : 10.1016/j.engfracmech.2007.12.010
  • ISSN : 0013-7944
  • eISSN : 1873-7315
  • Web of Science ID : WOS:000256014600015

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