2005年8月
Pre-cracking technique for fracture mechanics experiments along interface between thin film and substrate
ENGINEERING FRACTURE MECHANICS
- ,
- ,
- 巻
- 72
- 号
- 12
- 開始ページ
- 1892
- 終了ページ
- 1904
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1016/j.engfracmech.2004.08.010
- 出版者・発行元
- PERGAMON-ELSEVIER SCIENCE LTD
Utilizing the difference in interface strength due to fabrication process, a technique for producing a sharp pre-crack between a thin film and a substrate is proposed. A cracked specimen for examining fracture toughness of interface between a sputtered copper (Cu) thin film and silicon (Si) is made by the method. A vacuum-evaporated Cu thin film, which has poor adhesion to Si, is inserted between the sputtered Cu thin film and the Si substrate as a release layer. The release layer debonds from the Si substrate at very low load, and the sharp pre-crack is successfully introduced along the interface. Using the pre-cracked specimen, the interface fracture toughness test is conducted and the critical J-integral, J(C), is evaluated as about 1 J/m(2) for the sputtered Cu/Si interface. (c) 2005 Elsevier Ltd. All rights reserved.
- リンク情報
-
- DOI
- https://doi.org/10.1016/j.engfracmech.2004.08.010
- Web of Science
- https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000229496800008&DestApp=WOS_CPL
- URL
- https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=18144373113&origin=inward
- ID情報
-
- DOI : 10.1016/j.engfracmech.2004.08.010
- ISSN : 0013-7944
- SCOPUS ID : 18144373113
- Web of Science ID : WOS:000229496800008