論文

査読有り
2016年

Mechanical properties of urethane diacrylate/bamboo powder composite fabricated by rapid prototyping system

RAPID PROTOTYPING JOURNAL
  • Shih-Hsuan Chiu
  • ,
  • Ivan Ivan
  • ,
  • Cheng-Lung Wu
  • ,
  • Kun-Ting Chen
  • ,
  • Sigit Tri Wicaksono
  • ,
  • Hitoshi Takagi

22
4
開始ページ
676
終了ページ
683
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1108/RPJ-08-2014-0097
出版者・発行元
EMERALD GROUP PUBLISHING LTD

Purpose - Stereolithography is a well-established technique for producing complex part for rapid prototyping purpose by using UV or laser as a source for curing process. This technique has been implemented in a lot of industrial sectors. However, the parts fabricated by this technique exhibit low mechanical and thermal properties hindering a fast-growing application. The purpose of this paper is to propose a new method of digital light rapid prototyping (DLRP) system and investigate the effect of the addition of bamboo fiber with surface modification on improvement of mechanical properties of urethane diacrylate/bamboo composite.
Design/methodology/approach - Test specimens were fabricated using aliphatic urethane diacrylate photopolymer as matrix material and bamboo fiber as reinforce material. Adhesion between matrix and reinforce materials is a big issue in compositing, especially when handling bamboo as hydrophilic material and urethane diacrylate as hydrophobic material. To overcome this problem, two surface modifications of bamboo fiber, alkali treatment and silane treatment, were implemented.
Findings - As a result, bamboo fiber can increase mechanical properties of urethane diacrylate photopolymer fabricated by rapid prototyping system.
Originality/value - In this paper, the authors investigate the effect of the addition of bamboo powder with surface modification on mechanical properties. Test specimens were fabricated using aliphatic urethane diacrylate photopolymer as matrix material and bamboo powder as reinforce material.

リンク情報
DOI
https://doi.org/10.1108/RPJ-08-2014-0097
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000379835700006&DestApp=WOS_CPL
ID情報
  • DOI : 10.1108/RPJ-08-2014-0097
  • ISSN : 1355-2546
  • eISSN : 1758-7670
  • Web of Science ID : WOS:000379835700006

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