論文

査読有り
2010年2月

Electrical and thermal conductivities of porous SiC/SiO2/C composites with different morphology from carbonized wood

JOURNAL OF MATERIALS SCIENCE
  • Joko Sulistyo
  • ,
  • Toshimitsu Hata
  • ,
  • Hiroyuki Kitagawa
  • ,
  • Paul Bronsveld
  • ,
  • Masashi Fujisawa
  • ,
  • Kozo Hashimoto
  • ,
  • Yuji Imamura

45
4
開始ページ
1107
終了ページ
1116
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1007/s10853-009-4053-z
出版者・発行元
SPRINGER

Porous SiC/SiO2/C composites exhibiting a wide range of high thermal and electrical conductivities were developed from carbonized wood infiltrated with SiO2. As a pre-treatment, the samples were either heated at 100 A degrees C or kept at room temperature followed by sintering in the temperature range 1200-1800 A degrees C. The microstructure, the morphology, and the electrical and thermal conductivities of the composites were investigated. Pre-treatment at room temperature followed by sintering up to 1800 A degrees C produced composites exhibiting a greater size of carbon crystallites, a higher ordering of the microstructure of carbon and beta-SiC and a smaller amount of SiO2, resulting in electrical and thermal conductivities of 1.17 x 10(4) Omega(-1) m(-1) and 25 W/mK, respectively. The thermal conductivity could be further improved to 101 W/mK by increasing the density of the composite to 1.82 g/cm(3). In contrast, the pre-treatment at 100 A degrees C produced composites possessing a lower thermal conductivity of 2 W/mK.

リンク情報
DOI
https://doi.org/10.1007/s10853-009-4053-z
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000273033800033&DestApp=WOS_CPL
ID情報
  • DOI : 10.1007/s10853-009-4053-z
  • ISSN : 0022-2461
  • Web of Science ID : WOS:000273033800033

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