2018年12月
Via-Switch FPGA: Highly Dense Mixed-Grained Reconfigurable Architecture With Overlay Via-Switch Crossbars
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
- 巻
- 26
- 号
- 12
- 開始ページ
- 2723
- 終了ページ
- 2736
- 記述言語
- 掲載種別
- 研究論文（学術雑誌）
- DOI
- 10.1109/tvlsi.2018.2812914
- 出版者・発行元
- Institute of Electrical and Electronics Engineers (IEEE)
- リンク情報
-
- DOI
- https://doi.org/10.1109/tvlsi.2018.2812914
- DBLP
- https://dblp.uni-trier.de/rec/journals/tvlsi/OchiYFHKHIDTSTW18
- Web of Science
- https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000451999000016&DestApp=WOS_CPL
- URL
- http://xplorestaging.ieee.org/ielx7/92/8554317/08325430.pdf?arnumber=8325430
- ID情報
-
- DOI : 10.1109/tvlsi.2018.2812914
- ISSN : 1063-8210
- eISSN : 1557-9999
- DBLP ID : journals/tvlsi/OchiYFHKHIDTSTW18
- Web of Science ID : WOS:000451999000016