2004年7月
Wet treatment for preparing atomically smooth Si(100) wafer surface
APPLIED SURFACE SCIENCE
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- 巻
- 234
- 号
- 1-4
- 開始ページ
- 439
- 終了ページ
- 444
- 記述言語
- 英語
- 掲載種別
- DOI
- 10.1016/j.apsusc.2004.05.052
- 出版者・発行元
- ELSEVIER SCIENCE BV
A new wet treatment was used to prepare a Si(1 0 0) wafer surface and its surface morphology, atomic arrangement, and chemical structure over a large area were characterized by atomic force microscope, ultra-high vacuum scanning tunneling microscope, and Fourier-transform infrared spectroscopy with attenuated total reflection mode, respectively. An atomically smooth Si(1 0 0) wafer surface with a step/terrace periodic structure was prepared using a hot ammonium fluoride (NH4F) treatment at 76 degreesC. The surface exhibited mainly characteristic SiH2 surface termination structure, but was missing the atomic low 2 x 1 superlattice. A precisely controlled surface would be useful for Si ultra-large-scale integrated circuit (ULSI) device production. (C) 2004 Elsevier B.V. All rights reserved.
- リンク情報
- ID情報
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- DOI : 10.1016/j.apsusc.2004.05.052
- ISSN : 0169-4332
- Web of Science ID : WOS:000223500800073