論文

査読有り
2011年

3D modeling based on current continuity for STM carrier profiling of semiconductor devices

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD
  • Koichi Fukuda
  • ,
  • Masayasu Nishizawa
  • ,
  • Tetsuya Tada
  • ,
  • Leonid Bolotov
  • ,
  • Kaina Suzuki
  • ,
  • Shigeo Sato
  • ,
  • Hiroshi Arimoto
  • ,
  • Toshihiko Kanayama

開始ページ
259
終了ページ
262
記述言語
英語
掲載種別
研究論文(国際会議プロシーディングス)
DOI
10.1109/SISPAD.2011.6035074

Current continuity based 3D modeling of STM carrier profiling of semiconductor devices is achieved for the first time. Tunnel currents between probe tip and devices are solved consistently with current continuity consideration. It is revealed that tunnel current is reduced in current continuity model under depletion conditions. Spatial resolution achieved in the model is discussed in comparison to potential based modeling. Influence of discrete dopants is also discussed in concern with Coulomb potential fluctuations in nanoscale systems, which is a key issue of nano devices. © 2011 IEEE.

リンク情報
DOI
https://doi.org/10.1109/SISPAD.2011.6035074
URL
http://www.scopus.com/inward/record.url?eid=2-s2.0-80054971892&partnerID=MN8TOARS
URL
http://orcid.org/0000-0002-8326-3708
ID情報
  • DOI : 10.1109/SISPAD.2011.6035074
  • ORCIDのPut Code : 20800870
  • SCOPUS ID : 80054971892

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